[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"chain-detail":3,"chain-related-be5c17ae-9a06-4828-8111-6b0c0b4c7c2a":1389,"chain-scenarios-be5c17ae-9a06-4828-8111-6b0c0b4c7c2a":1397,"chain-expert-resolve-be5c17ae-9a06-4828-8111-6b0c0b4c7c2a":1955,"chain-related":2006},{"id":4,"name":5,"category":6,"groupCategory":7,"intro":8,"scale":9,"maturity":10,"meta":11,"checkState":705,"version":541,"createdBy":162,"createdAt":706,"updatedAt":707,"nodes":708},"be5c17ae-9a06-4828-8111-6b0c0b4c7c2a","集成电路产业链","战略性新兴产业","EMERGING","集成电路设计、制造、封装测试、装备材料，首批试点","中国集成电路全产业销售额约1.43万亿元(中国半导体行业协会，2024)；其中设计业约6460亿元(+11.9%)、制造业增长约14.5%、封测业增长约6.6%","成长期",{"ipc":12,"trl":22,"tier":25,"codes":26,"trade":28,"counts":36,"market":41,"source":75,"experts":76,"shaanxi":214,"sources":215,"clusters":221,"maturity":10,"policies":234,"source60":239,"chainCode":27,"matched60":240,"bottlenecks":241,"competition":532,"subCategory":566,"lifecycleStage":567,"strategic_note":109,"strategic_path":568,"key_technologies":571,"national_policies":579,"value_chain_profile":661,"regional_distribution":685},[13,16,19],{"code":14,"meaning":15},"H01L 21\u002F31","半导体器件制造中的薄膜处理(含沉积\u002F刻蚀)",{"code":17,"meaning":18},"H01L 23\u002F00","半导体器件的封装与外壳",{"code":20,"meaning":21},"H01L 27\u002F00","由多个固态器件组成的集成电路结构",{"basis":23,"range":24},"成熟制程规模商用(TRL9)，先进制程受设备出口管制仍在迭代(TRL6-7)","TRL8–9","新兴支柱",[27],"E01",{"exports":29,"sources":30,"dependence":32,"export_yoy":33,"export_value":34,"imports_note":35},"2025年集成电路出口额2019亿美元(+26.8%)，首破2000亿美元",[31],"https:\u002F\u002Fwww.ndrc.gov.cn\u002Fwsdwhfz\u002F202609\u002Ft20260916_1407663_ext.html","设备\u002F材料国产化率约35%，先进制程与HBM对外依存度高","+26.8%","2019亿美元","高端芯片、EUV设备、EDA及部分材料仍依赖进口",{"clusters":37,"segments":38,"companies":39,"bottlenecks":40},5,12,16,7,{"china":42,"global":62,"output":68,"sources":69,"output_yoy":72,"output_value":73,"equipment_market":74},{"yoy":43,"breakdown":44,"size_2025":60,"with_equipment_materials":61},"+19%",[45,50,55],{"yoy":46,"size":47,"share":48,"segment":49},"+29.4%","8357亿元","49.4%","芯片设计",{"yoy":51,"size":52,"share":53,"segment":54},"+12.0%","5009亿元","29.6%","晶圆制造",{"yoy":56,"size":57,"share":58,"segment":59},"+12.3%","3534亿元","21.0%","封装测试","约1.7万亿元（设计\u002F制造\u002F封测三业）","约1.9万亿元",{"yoy":63,"note":64,"size_2025":65,"yoy_2026e":66,"size_2026e":67},"+26.2%","WSTS最终统计，AI（数据中心GPU\u002FHBM）驱动，2026年逼近万亿美元","7956亿美元","+26.3%","9750亿美元","2025年集成电路产量4843亿块，同比+10.9%",[70,31,71],"https:\u002F\u002Fwww.wsts.org\u002F76\u002F103\u002FGlobal-Semiconductor-Market-grows-26-in-2025-to-796B","https:\u002F\u002Fwww.eet-china.com\u002Fmp\u002Fa479133.html","+10.9%","4843亿块","2025年中国大陆半导体设备销售额约493亿美元（SEMI），占全球约36.5%，连续6年全球第一","全产业智慧图谱数据库（公开版）",[77,83,89,95,100,105,110,115,120,126,132,136,141,146,152,158,164,170,175,181,186,192,197,203,209],{"org":78,"raw":79,"name":80,"note":81,"title":82},"清华大学集成电路学院","魏少军（清华大学集成电路学院），长聘教授，集成电路设计方法学专家，中国半导体行业协会集成电路设计分会理事长、IEEE Fellow","魏少军","集成电路设计方法学专家，中国半导体行业协会集成电路设计分会理事长、IEEE Fellow","长聘教授",{"org":84,"raw":85,"name":86,"note":87,"title":88},"北京大学集成电路学院","王阳元（北京大学集成电路学院），中国科学院院士，微电子学家，中芯国际创始人之一","王阳元","微电子学家，中芯国际创始人之一","中国科学院院士",{"org":90,"raw":91,"name":92,"note":93,"title":94},"北方华创科技集团股份有限公司","赵晋荣（北方华创科技集团股份有限公司），董事长，集成电路高端装备国产化领军者","赵晋荣","集成电路高端装备国产化领军者","董事长",{"org":96,"raw":97,"name":98,"note":99,"title":94},"长江存储科技有限责任公司","陈南翔（长江存储科技有限责任公司），董事长，长期从事集成电路技术与产业管理","陈南翔","长期从事集成电路技术与产业管理",{"org":101,"raw":102,"name":103,"note":104,"title":94},"北京华大九天科技股份有限公司","刘伟平（北京华大九天科技股份有限公司），董事长，国产EDA（数字\u002F模拟全流程）领域企业界代表","刘伟平","国产EDA（数字\u002F模拟全流程）领域企业界代表",{"org":106,"name":107,"note":108,"title":109},"长鑫科技","朱一明","存储器（DRAM国产化领军企业负责人","",{"org":111,"name":112,"note":113,"title":114},"中微半导体设备股份有限公司","尹志尧","中微公司创始人、董事长，刻蚀设备专家","中微公司创始人、董事长",{"org":116,"name":117,"note":118,"title":119},"芯恩集成电路有限公司","张汝京","中芯国际创始人，现创办芯恩（青岛","中芯国际创始人",{"org":121,"raw":122,"name":123,"note":124,"title":125},"中国科学院微电子研究所","叶甜春（中国科学院微电子研究所），原所长，集成电路技术专家","叶甜春","集成电路技术专家","原所长",{"org":127,"raw":128,"name":129,"note":130,"title":131},"浙江大学","吴汉明（浙江大学），中国工程院院士，晶圆制造工艺专家","吴汉明","晶圆制造工艺专家","中国工程院院士",{"org":127,"raw":133,"name":134,"note":135,"title":88},"杨德仁（浙江大学），中国科学院院士，半导体硅材料专家","杨德仁","半导体硅材料专家",{"org":137,"raw":138,"name":139,"note":140,"title":131},"有研科技集团","屠海令（有研科技集团），中国工程院院士，半导体材料专家","屠海令","半导体材料专家",{"org":142,"name":143,"note":144,"title":145},"芯原微电子股份有限公司","戴伟民","芯原股份创始人、董事长，半导体IP专家","芯原股份创始人、董事长",{"org":147,"raw":148,"name":149,"note":150,"title":151},"中科寒武纪科技股份有限公司","陈天石（中科寒武纪科技股份有限公司），寒武纪创始人、董事长，AI芯片专家","陈天石","AI芯片专家","寒武纪创始人、董事长",{"org":153,"raw":154,"name":155,"note":156,"title":157},"中国半导体行业协会","周子学（中国半导体行业协会），协会理事长，曾任中芯国际董事长","周子学","曾任中芯国际董事长","协会理事长",{"org":159,"raw":160,"name":161,"note":162,"title":163},"中芯国际集成电路制造有限公司","赵海军（中芯国际集成电路制造有限公司），中芯国际联合首席执行官","赵海军",null,"中芯国际联合首席执行官",{"org":165,"raw":166,"name":167,"note":168,"title":169},"清华大学","汪玉（清华大学），电子工程系教授，AI芯片与集成电路设计专家","汪玉","AI芯片与集成电路设计专家","电子工程系教授",{"org":165,"raw":171,"name":172,"note":173,"title":174},"孙楠（清华大学），集成电路学院教授，EDA与模拟集成电路专家","孙楠","EDA与模拟集成电路专家","集成电路学院教授",{"org":176,"raw":177,"name":178,"note":179,"title":180},"奕斯伟集团","王东升（奕斯伟集团），京东方创始人，现布局硅片与芯片产业","王东升","现布局硅片与芯片产业","京东方创始人",{"org":182,"raw":183,"name":184,"note":185,"title":88},"中国科学院上海微系统与信息技术研究所","王曦（中国科学院上海微系统与信息技术研究所），中国科学院院士，半导体材料与器件专家","王曦","半导体材料与器件专家",{"org":187,"raw":188,"name":189,"note":190,"title":191},"华为技术有限公司","何庭波（华为技术有限公司），海思总裁，芯片设计专家","何庭波","芯片设计专家","海思总裁",{"org":193,"raw":194,"name":195,"note":196,"title":88},"复旦大学","刘明（复旦大学），中国科学院院士，存储器技术专家","刘明","存储器技术专家",{"org":198,"raw":199,"name":200,"note":201,"title":202},"西安交通大学","耿莉（西安交通大学），微电子学院院长、教授，电源管理与功率器件","耿莉","电源管理与功率器件","微电子学院院长、教授",{"org":204,"raw":205,"name":206,"note":207,"title":208},"西安电子科技大学","张进成（西安电子科技大学），副校长、二级教授，宽禁带半导体器件","张进成","宽禁带半导体器件","副校长、二级教授",{"org":198,"raw":210,"name":211,"note":212,"title":213},"王宏兴（西安交通大学），教授，电子物理与器件教育部重点实验室主任","王宏兴","电子物理与器件教育部重点实验室主任","教授","半导体及集成电路",[216,217,218,219,220],"https:\u002F\u002Fwww.smics.com\u002Fen\u002Fsite\u002Fnews_read\u002F7959","https:\u002F\u002Fwww.amec-inc.com\u002F?lang=zh_CN","https:\u002F\u002Fcaifuhao.eastmoney.com\u002Fnews\u002F20260524104955925489450","https:\u002F\u002Fwww.stcn.com\u002Farticle\u002Fdetail\u002F3951448.html","http:\u002F\u002Fwww.sse.com.cn\u002Fdisclosure\u002Ffund\u002Fetflist\u002Fdetail.shtml?fundid=512760",[222,226,228,230],{"city":223,"name":224,"level":225},"西安","西安高新技术产业开发区","国家级",{"city":223,"name":227,"level":225},"西安市集成电路产业集群",{"city":223,"name":229,"level":225},"西安经济技术开发区",{"city":231,"name":232,"level":233},"铜川","铜川光电子产业园","省级",[235,236,237,238],"国家集成电路产业发展推进纲要","大基金一期\u002F二期\u002F三期重点投资设备材料与先进制造","十四五数字经济发展规划","半导体自主可控国产替代政策","全产业60链图谱",true,[242,303,345,391,411,426,469],{"name":243,"risk":244,"type":245,"status":246,"experts":247,"policies":248,"progress":273,"companies":274,"policy_support":302},"EUV\u002FDUV高端光刻机","风险：高","设备","依赖进口",[],[249,255,261,267],{"raw":250,"date":251,"name":252,"doc_no":162,"issuer":253,"summary":254},"《中华人民共和国国民经济和社会发展第十五个五年规划纲要》（全国人民代表大会，2026-03）：提出以超常规措施全链条推动集成电路等关键核心技术攻关取得决定性突破。","2026-03","中华人民共和国国民经济和社会发展第十五个五年规划纲要","全国人民代表大会","提出以超常规措施全链条推动集成电路等关键核心技术攻关取得决定性突破。",{"raw":256,"date":257,"name":258,"doc_no":162,"issuer":259,"summary":260},"《上海市支持先进制造业转型升级三年行动方案（2026—2028年）》（上海市人民政府办公厅，2026-02）：支持集成电路全产业链突破，重点瞄准装备、先进工艺、光刻胶材料、3D封装等方向。","2026-02","上海市支持先进制造业转型升级三年行动方案（2026—2028年）","上海市人民政府办公厅","支持集成电路全产业链突破，重点瞄准装备、先进工艺、光刻胶材料、3D封装等方向。",{"raw":262,"date":263,"name":264,"doc_no":162,"issuer":265,"summary":266},"《电子信息制造业发展“十五五”规划》（工业和信息化部、国家发展改革委，2026-09）：部署电子信息制造业未来五年发展，提出加快EDA和IP核发展、提升电子专用设备供给能力，完善首台（套）保险补偿等支持政策。","2026-09","电子信息制造业发展“十五五”规划","工业和信息化部、国家发展改革委","部署电子信息制造业未来五年发展，提出加快EDA和IP核发展、提升电子专用设备供给能力，完善首台（套）保险补偿等支持政策。",{"raw":268,"date":269,"name":270,"doc_no":162,"issuer":271,"summary":272},"《关于推动未来产业创新发展的实施意见》（工业和信息化部等七部门，2024-01）：部署前沿技术攻关，强化高端装备与关键部件创新","2024-01","关于推动未来产业创新发展的实施意见","工业和信息化部等七部门","部署前沿技术攻关，强化高端装备与关键部件创新","上海微电子28nm DUV推进中",[275,278,281,284,287,290,293,296,299],{"name":276,"note":277},"上海微电子","光刻机整机",{"name":279,"note":280},"上海宇量昇","浸没式光刻机研发",{"name":282,"note":283},"芯上微装","先进封装光刻机",{"name":285,"note":286},"北京科益虹源","ArF准分子激光光源",{"name":288,"note":289},"福晶科技","激光晶体与精密光学元件",{"name":291,"note":292},"华卓精科","双工件台与精密运动系统",{"name":294,"note":295},"国望光学","光刻机投影物镜等光学系统",{"name":297,"note":298},"启尔机电","浸没式光刻机浸液与流控系统",{"name":300,"note":301},"炬光科技","激光光源与光学元器件","集成电路攻关",{"name":304,"risk":244,"type":305,"status":246,"experts":306,"policies":309,"progress":314,"companies":315,"policy_support":344},"高端EDA工具(数字\u002F模拟全流程)","软件",[307,308],{"org":101,"raw":102,"name":103,"note":104,"title":94},{"org":165,"raw":171,"name":172,"note":173,"title":174},[310,311],{"raw":262,"date":263,"name":264,"doc_no":162,"issuer":265,"summary":266},{"raw":312,"date":269,"name":270,"doc_no":162,"issuer":271,"summary":313},"《关于推动未来产业创新发展的实施意见》（工业和信息化部等七部门，2024-01）：强化基础软件与工具链创新，支撑先进制程设计","强化基础软件与工具链创新，支撑先进制程设计","华大九天、概伦电子部分点工具突破",[316,318,320,322,324,326,329,332,335,338,341],{"name":317,"note":162},"华大九天",{"name":319,"note":162},"概伦电子",{"name":321,"note":162},"芯华章",{"name":323,"note":162},"思尔芯",{"name":325,"note":162},"广立微",{"name":327,"note":328},"合见工软","数字验证全流程EDA",{"name":330,"note":331},"芯行纪","数字实现EDA",{"name":333,"note":334},"鸿芯微纳","数字后端布局布线EDA",{"name":336,"note":337},"芯和半导体","先进封装与仿真EDA",{"name":339,"note":340},"九同方","射频与模拟EDA",{"name":342,"note":343},"芯愿景","电路分析EDA与IP服务","工业软件",{"name":346,"risk":244,"type":347,"status":348,"experts":349,"policies":352,"progress":378,"companies":379,"policy_support":390},"14nm以下先进制程工艺","工艺技术","已突破",[350,351],{"org":84,"raw":85,"name":86,"note":87,"title":88},{"org":127,"raw":128,"name":129,"note":130,"title":131},[353,360,366,372],{"raw":354,"date":355,"name":356,"doc_no":357,"issuer":358,"summary":359},"《关于做好2025年享受税收优惠政策的集成电路企业或项目、软件企业清单制定工作的通知》（发改高技〔2025〕385号）（国家发展改革委等，2025-04）：明确2025年享受税收优惠的集成电路企业范围，涵盖≤28\u002F65\u002F130nm生产、设计及靶材、光刻胶、掩模版、封装载板、抛光材料、硅片等关键环节。","2025-04","关于做好2025年享受税收优惠政策的集成电路企业或项目、软件企业清单制定工作的通知","发改高技〔2025〕385号","国家发展改革委等","明确2025年享受税收优惠的集成电路企业范围，涵盖≤28\u002F65\u002F130nm生产、设计及靶材、光刻胶、掩模版、封装载板、抛光材料、硅片等关键环节。",{"raw":361,"date":362,"name":363,"doc_no":364,"issuer":358,"summary":365},"《关于做好2026年享受税收优惠政策的集成电路企业或项目、软件企业清单制定工作的通知》（发改高技〔2026〕487号）（国家发展改革委等，2026-04）：继续以清单方式落实集成电路企业税收优惠，覆盖先进制程生产、设计、关键原材料零配件及先进封装测试企业。","2026-04","关于做好2026年享受税收优惠政策的集成电路企业或项目、软件企业清单制定工作的通知","发改高技〔2026〕487号","继续以清单方式落实集成电路企业税收优惠，覆盖先进制程生产、设计、关键原材料零配件及先进封装测试企业。",{"raw":367,"date":368,"name":369,"doc_no":162,"issuer":370,"summary":371},"《产业结构调整指导目录（2024年本）》（国家发展和改革委员会，2024-02）：先进制程制造列入鼓励类","2024-02","产业结构调整指导目录（2024年本）","国家发展和改革委员会","先进制程制造列入鼓励类",{"raw":373,"date":374,"name":375,"doc_no":162,"issuer":376,"summary":377},"《关于提高集成电路和工业母机企业研发费用加计扣除比例的公告》（财政部等四部门，2023-08）：集成电路企业研发费用加计扣除比例提高至120%","2023-08","关于提高集成电路和工业母机企业研发费用加计扣除比例的公告","财政部等四部门","集成电路企业研发费用加计扣除比例提高至120%","中芯国际14nm量产 7nm研发",[380,382,384,386,387],{"name":381,"note":162},"中芯国际",{"name":383,"note":162},"华虹集团",{"name":385,"note":162},"长江存储",{"name":106,"note":162},{"name":388,"note":389},"中芯南方","中芯国际先进制程12英寸产线","集成电路发展",{"name":392,"risk":244,"type":347,"status":246,"experts":393,"policies":394,"progress":400,"companies":401,"policy_support":162},"先进光刻机（EUV\u002F高端DUV）",[],[395,396,397],{"raw":250,"date":251,"name":252,"doc_no":162,"issuer":253,"summary":254},{"raw":256,"date":257,"name":258,"doc_no":162,"issuer":259,"summary":260},{"raw":398,"date":269,"name":270,"doc_no":162,"issuer":271,"summary":399},"《关于推动未来产业创新发展的实施意见》（工业和信息化部等七部门，2024-01）：部署前沿技术攻关，强化高端光刻装备创新","部署前沿技术攻关，强化高端光刻装备创新","EUV被ASML垄断（NA0.33量产、High-NA出货）；国产上海微电子28nm级DUV攻关中，光刻机整体国产化率约1%",[402,403,404,405,406,407,408,409,410],{"name":276,"note":277},{"name":279,"note":280},{"name":282,"note":283},{"name":285,"note":286},{"name":288,"note":289},{"name":291,"note":292},{"name":294,"note":295},{"name":297,"note":298},{"name":300,"note":301},{"name":412,"risk":244,"type":347,"status":413,"experts":414,"policies":416,"progress":419,"companies":420,"policy_support":162},"先进制程制造（7nm及以下）","部分突破",[415],{"org":127,"raw":128,"name":129,"note":130,"title":131},[417,418],{"raw":250,"date":251,"name":252,"doc_no":162,"issuer":253,"summary":254},{"raw":354,"date":355,"name":356,"doc_no":357,"issuer":358,"summary":359},"台积电3nm量产、2nm(GAA)推进；中芯国际N+1\u002FN+2受设备与EDA管制，全球代工份额台积电69.9%",[421,422,423,424,425],{"name":381,"note":162},{"name":383,"note":162},{"name":385,"note":162},{"name":106,"note":162},{"name":388,"note":389},{"name":427,"risk":244,"type":347,"status":413,"experts":428,"policies":438,"progress":443,"companies":444,"policy_support":162},"大硅片（300mm）",[429,430,433],{"org":127,"raw":133,"name":134,"note":135,"title":88},{"org":176,"raw":431,"name":178,"note":432,"title":180},"王东升（奕斯伟集团），京东方创始人，现布局硅片产业","现布局硅片产业",{"org":434,"raw":435,"name":436,"note":437,"title":94},"西安奕材","杨新元（西安奕材），董事长，12英寸大硅片产业化","杨新元","12英寸大硅片产业化",[439,440],{"raw":354,"date":355,"name":356,"doc_no":357,"issuer":358,"summary":359},{"raw":441,"date":368,"name":369,"doc_no":162,"issuer":370,"summary":442},"《产业结构调整指导目录（2024年本）》（国家发展和改革委员会，2024-02）：大尺寸硅片等关键材料列入鼓励类","大尺寸硅片等关键材料列入鼓励类","信越\u002FSUMCO合计约53%，12英寸国产化率约12%；沪硅产业、西安奕材、有研硅规模量产导入",[445,447,448,451,454,456,459,461,464,467],{"name":446,"note":162},"沪硅产业",{"name":434,"note":162},{"name":449,"note":450},"TCL中环","中环领先",{"name":452,"note":453},"立昂微","金瑞泓",{"name":455,"note":162},"有研硅",{"name":457,"note":458},"中欣晶圆","300mm硅片",{"name":460,"note":458},"上海超硅",{"name":462,"note":463},"鑫晶半导体","12英寸硅片",{"name":465,"note":466},"鑫华半导体","电子级多晶硅原料",{"name":434,"note":468},"12英寸硅片，国内第一、全球第六",{"name":470,"risk":244,"type":347,"status":246,"experts":471,"policies":479,"progress":487,"companies":488,"policy_support":162},"HBM高带宽存储",[472,478],{"org":473,"raw":474,"name":475,"note":476,"title":477},"长鑫存储","朱一明（长鑫科技（长鑫存储）），存储器（DRAM）国产化领军企业负责人","朱一明（长鑫科技","存储器（DRAM）国产化领军企业负责人","）",{"org":193,"raw":194,"name":195,"note":196,"title":88},[480,481],{"raw":361,"date":362,"name":363,"doc_no":364,"issuer":358,"summary":365},{"raw":482,"date":483,"name":484,"doc_no":162,"issuer":485,"summary":486},"《关于深入实施“人工智能+”行动的意见》（国务院，2025-08）：人工智能算力需求带动高带宽存储等产业发展","2025-08","关于深入实施“人工智能+”行动的意见","国务院","人工智能算力需求带动高带宽存储等产业发展","SK海力士\u002F三星\u002F美光三家垄断HBM3E；国产长鑫存储、武汉新芯攻关，量产差距明显",[489,491,493,496,498,500,503,506,509,512,515,518,521,524,527,530],{"name":106,"note":490},"DRAM存储",{"name":385,"note":492},"存储工艺与三维集成",{"name":494,"note":495},"通富微电","先进封装",{"name":497,"note":495},"长电科技",{"name":499,"note":495},"华天科技",{"name":501,"note":502},"武汉新芯","三维集成代工",{"name":504,"note":505},"深科技","旗下沛顿科技，DRAM封测",{"name":507,"note":508},"太极实业","旗下海太半导体，DRAM封测",{"name":510,"note":511},"佰维存储","存储器研发封测与模组",{"name":513,"note":514},"澜起科技","内存接口芯片与CXL",{"name":516,"note":517},"华海诚科","先进封装材料",{"name":519,"note":520},"联瑞新材","封装用球形硅微粉等材料",{"name":522,"note":523},"美光","西安，DRAM封装测试基地",{"name":525,"note":526},"三星","西安，3D V-NAND先进存储制造",{"name":528,"note":529},"西安紫光国芯","DRAM存储芯片设计",{"name":434,"note":531},"硅片适配HBM先进封装",{"foundry":533,"pattern":534,"sources":535,"global_top":539,"domestic_rate":560,"fabless_top10":565},"台积电69.9%（营收约1225亿美元\u002F+36.1%）、三星第二、中芯国际第三","全球呈高度寡头垄断（代工\u002F设备\u002FEDA\u002F存储）；中国三业并进，设备材料加速国产替代",[536,537,538],"https:\u002F\u002Fpdf.dfcfw.com\u002Fpdf\u002FH3_AP202602261820053913_1.pdf","https:\u002F\u002Fwww.stcn.com\u002Farticle\u002Fdetail\u002F3722672.html","https:\u002F\u002Fm.jiemian.com\u002Farticle\u002F15117521.html",[540,545,550,555],{"rank":541,"share":542,"company":543,"revenue":544},1,"15.8%","英伟达","1257亿美元",{"rank":546,"share":547,"company":548,"revenue":549},2,"9.1%","三星电子","725亿美元",{"rank":551,"share":552,"company":553,"revenue":554},3,"7.6%","SK海力士","606亿美元",{"rank":556,"share":557,"company":558,"revenue":559},4,"6.0%","英特尔","479亿美元",{"wfe_self":561,"lithography":562,"new_purchase":563,"equipment_installed":564},"21%（伯恩斯坦口径，2024为16%）","约1%","23%（当年新购设备）","35%（晶圆厂已安装，2024为25%）","2025全球前十IC设计合计3594亿美元\u002F+44%，英伟达第一、博通第二、高通第三；韦尔（豪威）列全球第八","新一代信息技术（集成电路）","GROWTH",[569,570],"1 新一代信息技术产业 → 1.2 电子核心产业 → 集成电路制造(3973)\u002F半导体器件专用设备(3562)\u002F电子专用材料(3985)","1 新一代信息技术产业 → 1.3 新兴软件和新型信息技术服务 → 新型信息技术服务(6520集成电路设计)\u002FEDA支撑软件(6512)",[572,573,574,575,576,577,578],{"risk":244,"tech":243,"type":245,"status":246,"bottleneck":240,"domestic_status":273},{"risk":244,"tech":304,"type":305,"status":246,"bottleneck":240,"domestic_status":314},{"risk":244,"tech":346,"type":347,"status":348,"bottleneck":240,"domestic_status":378},{"risk":244,"tech":392,"type":347,"status":246,"bottleneck":240,"domestic_status":400},{"risk":244,"tech":412,"type":347,"status":413,"bottleneck":240,"domestic_status":419},{"risk":244,"tech":427,"type":347,"status":413,"bottleneck":240,"domestic_status":443},{"risk":244,"tech":470,"type":347,"status":246,"bottleneck":240,"domestic_status":487},[580,581,582,583,590,591,592,597,602,605,608,612,618,624,629,634,637,644,649,655],{"raw":262,"date":263,"name":264,"doc_no":162,"issuer":265,"summary":266},{"raw":361,"date":362,"name":363,"doc_no":364,"issuer":358,"summary":365},{"raw":354,"date":355,"name":356,"doc_no":357,"issuer":358,"summary":359},{"raw":584,"date":585,"name":586,"doc_no":587,"issuer":588,"summary":589},"《关于2025年度享受增值税加计抵减政策的集成电路企业清单制定工作有关要求的通知》（工信部联电子函〔2025〕234号）（工业和信息化部、国家发展改革委、财政部、税务总局，2025-09）：明确2025年度集成电路企业享受增值税加计抵减政策的清单制定要求。","2025-09","关于2025年度享受增值税加计抵减政策的集成电路企业清单制定工作有关要求的通知","工信部联电子函〔2025〕234号","工业和信息化部、国家发展改革委、财政部、税务总局","明确2025年度集成电路企业享受增值税加计抵减政策的清单制定要求。",{"raw":256,"date":257,"name":258,"doc_no":162,"issuer":259,"summary":260},{"raw":250,"date":251,"name":252,"doc_no":162,"issuer":253,"summary":254},{"raw":593,"date":483,"name":594,"doc_no":162,"issuer":595,"summary":596},"《关于金融支持新型工业化的指导意见》（中国人民银行等七部门，2025-08）：提出为集成电路等重点产业链提供中长期融资等金融支持。","关于金融支持新型工业化的指导意见","中国人民银行等七部门","提出为集成电路等重点产业链提供中长期融资等金融支持。",{"raw":598,"date":483,"name":599,"doc_no":162,"issuer":600,"summary":601},"《电子信息制造业2025—2026年稳增长行动方案》（工业和信息化部、市场监管总局，2025-08）：部署电子信息制造业稳增长举措，推动集成电路等重点领域持续向好。","电子信息制造业2025—2026年稳增长行动方案","工业和信息化部、市场监管总局","部署电子信息制造业稳增长举措，推动集成电路等重点领域持续向好。",{"raw":603,"date":269,"name":270,"doc_no":162,"issuer":271,"summary":604},"《关于推动未来产业创新发展的实施意见》（工业和信息化部等七部门，2024-01）：布局未来信息等六大方向，部署前沿技术攻关与创新联合体建设","布局未来信息等六大方向，部署前沿技术攻关与创新联合体建设",{"raw":606,"date":368,"name":369,"doc_no":162,"issuer":370,"summary":607},"《产业结构调整指导目录（2024年本）》（国家发展和改革委员会，2024-02）：集成电路设计、先进制造及设备材料等列入鼓励类，引导产业投资","集成电路设计、先进制造及设备材料等列入鼓励类，引导产业投资",{"raw":609,"date":374,"name":375,"doc_no":162,"issuer":610,"summary":611},"《关于提高集成电路和工业母机企业研发费用加计扣除比例的公告》（财政部、税务总局、国家发展改革委、工业和信息化部，2023-08）：集成电路与工业母机企业研发费用加计扣除比例提高至120%","财政部、税务总局、国家发展改革委、工业和信息化部","集成电路与工业母机企业研发费用加计扣除比例提高至120%",{"raw":613,"date":614,"name":615,"doc_no":162,"issuer":616,"summary":617},"《促进创业投资高质量发展的若干政策措施》（国务院办公厅，2024-06）：拓宽退出渠道，引导长期资本投早、投小、投硬科技","2024-06","促进创业投资高质量发展的若干政策措施","国务院办公厅","拓宽退出渠道，引导长期资本投早、投小、投硬科技",{"raw":619,"date":620,"name":621,"doc_no":162,"issuer":622,"summary":623},"《商务部公告2024年第46号（关于加强相关两用物项对美国出口管制的公告）》（商务部，2024-12）：加强镓、锗、锑等相关两用物项对美国出口管制，维护国家安全和利益","2024-12","商务部公告2024年第46号（关于加强相关两用物项对美国出口管制的公告）","商务部","加强镓、锗、锑等相关两用物项对美国出口管制，维护国家安全和利益",{"raw":625,"date":626,"name":627,"doc_no":162,"issuer":616,"summary":628},"《关于促进政府投资基金高质量发展的指导意见》（国务院办公厅，2025-01）：规范政府投资基金布局与运作，引导投向硬科技等关键领域","2025-01","关于促进政府投资基金高质量发展的指导意见","规范政府投资基金布局与运作，引导投向硬科技等关键领域",{"raw":630,"date":614,"name":631,"doc_no":162,"issuer":632,"summary":633},"《国家人工智能产业综合标准化体系建设指南（2024版）》（工业和信息化部等四部门，2024-06）：部署智能芯片、大模型等标准研制，支撑人工智能产业规范发展","国家人工智能产业综合标准化体系建设指南（2024版）","工业和信息化部等四部门","部署智能芯片、大模型等标准研制，支撑人工智能产业规范发展",{"raw":635,"date":483,"name":484,"doc_no":162,"issuer":485,"summary":636},"《关于深入实施“人工智能+”行动的意见》（国务院，2025-08）：部署人工智能与各行业深度融合，带动智能算力与芯片产业需求","部署人工智能与各行业深度融合，带动智能算力与芯片产业需求",{"raw":638,"date":639,"name":640,"doc_no":641,"issuer":642,"summary":643},"《关于建立省重点产业链“链长制”工作机制的通知》（陕办字〔2024〕20号）（陕西省委办公厅、省政府办公厅，2024）：省级重点产业链由24条优化拓展为34条，实行链长统筹、链主带动、专班服务、市县协同工作机制","2024","关于建立省重点产业链“链长制”工作机制的通知","陕办字〔2024〕20号","陕西省委办公厅、省政府办公厅","省级重点产业链由24条优化拓展为34条，实行链长统筹、链主带动、专班服务、市县协同工作机制",{"raw":645,"date":362,"name":646,"doc_no":162,"issuer":647,"summary":648},"《陕西省国民经济和社会发展第十五个五年规划纲要》（陕西省人民政府，2026-04）：实施半导体及集成电路全产业链提升工程，攻关宽禁带半导体材料工艺，培育西安集成电路国家战略性新兴产业集群","陕西省国民经济和社会发展第十五个五年规划纲要","陕西省人民政府","实施半导体及集成电路全产业链提升工程，攻关宽禁带半导体材料工艺，培育西安集成电路国家战略性新兴产业集群",{"raw":650,"date":651,"name":652,"doc_no":162,"issuer":653,"summary":654},"《西安市促进半导体及光子产业高质量发展实施方案》（西安市人民政府办公厅，2026-05）：到2030年半导体及光子产值达3000亿元，重点布局第三代半导体、先进封装、大硅片与CIM系统国产化","2026-05","西安市促进半导体及光子产业高质量发展实施方案","西安市人民政府办公厅","到2030年半导体及光子产值达3000亿元，重点布局第三代半导体、先进封装、大硅片与CIM系统国产化",{"raw":656,"date":657,"name":658,"doc_no":162,"issuer":659,"summary":660},"《西安市促进半导体及光子产业能力提升实施方案（2025—2027年）》（西安市人民政府，2025-06）：以功率半导体与光子芯片两大子集群为核心，2027年电子信息产业总产值突破2000亿元","2025-06","西安市促进半导体及光子产业能力提升实施方案（2025—2027年）","西安市人民政府","以功率半导体与光子芯片两大子集群为核心，2027年电子信息产业总产值突破2000亿元",{"note":662,"sources":663,"value_add":666},"设计附加值最高。长江商学院刘劲口径：设计53%\u002F制造24%\u002F封测6%\u002F设备11%；Nuvama口径：设计50%\u002F制造36%\u002F封测9%\u002F材料5%",[664,665],"https:\u002F\u002Fwww.ckgsb.edu.cn\u002Ffaculty\u002Fnews\u002Fdetail\u002F157\u002F6559.html","https:\u002F\u002Fpdf.dfcfw.com\u002Fpdf\u002FH3_AP202501111641894782_1.pdf",[667,671,674,678,681],{"share":668,"stage":669,"margin":670},"约50–53%","IC设计\u002FEDA","高（龙头40–60%，EDA 80%+）",{"share":672,"stage":54,"margin":673},"约24–36%","中高（代工30–50%）",{"share":675,"stage":676,"margin":677},"约11%","半导体设备","高（国产设备约40%）",{"share":679,"stage":59,"margin":680},"约6–9%","低（传统10–15%，先进封装净利率近30%）",{"share":682,"stage":683,"margin":684},"约5%","半导体材料","高（硅片\u002F抛光垫50–66%）",[686,691,696,701],{"scale":687,"layout":688,"region":689,"feature":690},"上海约5800亿元(+15.5%)、无锡约占全国10.6%","上海张江·临港、无锡、苏州、合肥","长三角（上海\u002F无锡\u002F苏州\u002F南京\u002F合肥）","全产业链最完整，制造\u002F封测\u002F设备材料高度集聚",{"scale":692,"layout":693,"region":694,"feature":695},"深圳约3610亿元(+27.1%)","深圳南山·宝安","珠三角（深圳\u002F珠海）","IC设计领先，设计业约占全国29.3%",{"scale":697,"layout":698,"region":699,"feature":700},"—","北京、天津","环渤海（北京\u002F天津）","设计+制造均衡，北京亦庄集群",{"scale":697,"layout":702,"region":703,"feature":704},"武汉、西安、成都","中西部（武汉\u002F成都\u002F西安\u002F重庆）","存储与制造突出：武汉长存、西安三星、成都IDM","VERIFIED","2026-10-09T13:20:56.387Z","2026-10-14T07:01:44.082Z",[709,814,856,912,955,1014,1094,1160,1200,1249,1309,1348],{"id":710,"chainId":4,"layer":711,"segment":712,"name":712,"keyPoints":713,"companies":714,"sortOrder":782,"isKey":783,"checkState":705,"meta":784,"createdAt":812,"links":813},"cnH_E01_01","上游","集成电路设计","CPU\u002FAI芯片\u002FCIS\u002FSoC\u002F存储\u002F模拟射频等；先进制程GPU\u002FCPU受出口管制",[715,718,721,724,727,730,733,736,738,741,744,747,750,753,756,759,762,765,767,770,773,776,779],{"name":716,"note":717},"韦尔股份","图像传感器等芯片设计",{"name":719,"note":720},"紫光展锐","手机SoC设计",{"name":722,"note":723},"寒武纪","AI芯片",{"name":725,"note":726},"兆易创新","存储与MCU设计",{"name":728,"note":729},"汇顶科技","人机交互芯片",{"name":731,"note":732},"海光信息","高端CPU与DCU芯片设计",{"name":734,"note":735},"龙芯中科","自主指令集CPU设计",{"name":513,"note":737},"内存接口芯片",{"name":739,"note":740},"圣邦股份","模拟集成电路设计",{"name":742,"note":743},"纳芯微","汽车模拟与传感器芯片",{"name":745,"note":746},"卓胜微","射频前端芯片",{"name":748,"note":749},"复旦微电","FPGA与安全芯片",{"name":751,"note":752},"紫光国微","特种与安全芯片设计",{"name":754,"note":755},"瑞芯微","AIoT处理器芯片",{"name":757,"note":758},"恒玄科技","智能音频SoC芯片",{"name":760,"note":761},"地平线","智能驾驶计算芯片",{"name":763,"note":764},"黑芝麻智能","车规级智驾芯片",{"name":528,"note":766},"DRAM等存储芯片设计",{"name":768,"note":769},"博瑞集信","射频与微波芯片设计",{"name":771,"note":772},"亚成微","超结MOSFET等功率器件",{"name":774,"note":775},"天健九方","西安，毫米波芯片设计",{"name":777,"note":778},"西安克瑞斯","专用集成电路设计",{"name":780,"note":781},"西岳电子","专用芯片设计",0,false,{"source":75,"experts":785,"policies":800,"chainCode":27,"aggregationZones":809},[786,787,788,791,796],{"org":78,"raw":79,"name":80,"note":81,"title":82},{"org":147,"raw":148,"name":149,"note":150,"title":151},{"org":165,"raw":789,"name":167,"note":790,"title":169},"汪玉（清华大学），电子工程系教授，AI芯片与芯片设计专家","AI芯片与芯片设计专家",{"org":792,"raw":793,"name":794,"note":144,"title":795},"上海","戴伟民（芯原微电子（上海）股份有限公司），芯原股份创始人、董事长，半导体IP专家","戴伟民（芯原微电子","股份有限公司）",{"org":198,"raw":797,"name":200,"note":798,"title":799},"耿莉（西安交通大学），微电子学院院长，集成电路与功率器件设计","集成电路与功率器件设计","微电子学院院长",[801,802,803,806],{"raw":361,"date":362,"name":363,"doc_no":364,"issuer":358,"summary":365},{"raw":250,"date":251,"name":252,"doc_no":162,"issuer":253,"summary":254},{"raw":804,"date":368,"name":369,"doc_no":162,"issuer":370,"summary":805},"《产业结构调整指导目录（2024年本）》（国家发展和改革委员会，2024-02）：集成电路设计等列入鼓励类，引导产业投资方向","集成电路设计等列入鼓励类，引导产业投资方向",{"raw":807,"date":269,"name":270,"doc_no":162,"issuer":271,"summary":808},"《关于推动未来产业创新发展的实施意见》（工业和信息化部等七部门，2024-01）：布局未来信息等方向，部署前沿技术攻关","布局未来信息等方向，部署前沿技术攻关",[810],{"city":223,"name":224,"note":811,"level":225},"集成电路设计企业核心聚集区","2026-10-12T14:28:52.196Z",[],{"id":815,"chainId":4,"layer":816,"segment":817,"name":817,"keyPoints":162,"companies":818,"sortOrder":541,"isKey":240,"checkState":705,"meta":836,"createdAt":854,"links":855},"cnH_E01_02","支撑","光刻机",[819,820,821,822,823,824,825,826,828,830,833],{"name":276,"note":277},{"name":279,"note":280},{"name":282,"note":283},{"name":285,"note":286},{"name":288,"note":289},{"name":291,"note":292},{"name":294,"note":295},{"name":297,"note":827},"浸没式光刻机浸液与超洁净流控系统",{"name":300,"note":829},"激光光源与激光光学元器件",{"name":831,"note":832},"芯碁微装","激光直写光刻设备",{"name":834,"note":835},"苏大维格","微纳光学与直写光刻设备",{"source":75,"experts":837,"policies":843,"chainCode":27,"aggregationZones":853},[838],{"org":839,"raw":840,"name":841,"note":842,"title":795},"集团","贺荣明（上海微电子装备（集团）股份有限公司），上海微电子装备公司创建者之一，光刻装备专家","贺荣明（上海微电子装备","上海微电子装备公司创建者之一，光刻装备专家",[844,845,846,847,850],{"raw":250,"date":251,"name":252,"doc_no":162,"issuer":253,"summary":254},{"raw":256,"date":257,"name":258,"doc_no":162,"issuer":259,"summary":260},{"raw":262,"date":263,"name":264,"doc_no":162,"issuer":265,"summary":266},{"raw":848,"date":368,"name":369,"doc_no":162,"issuer":370,"summary":849},"《产业结构调整指导目录（2024年本）》（国家发展和改革委员会，2024-02）：半导体关键设备等列入鼓励类","半导体关键设备等列入鼓励类",{"raw":851,"date":269,"name":270,"doc_no":162,"issuer":271,"summary":852},"《关于推动未来产业创新发展的实施意见》（工业和信息化部等七部门，2024-01）：部署前沿技术攻关，强化高端装备创新","部署前沿技术攻关，强化高端装备创新",[],"2026-10-12T14:28:52.203Z",[],{"id":857,"chainId":4,"layer":858,"segment":859,"name":859,"keyPoints":860,"companies":861,"sortOrder":546,"isKey":240,"checkState":705,"meta":893,"createdAt":910,"links":911},"cnH_E01_03","中游","晶圆制造（前道）","逻辑\u002F存储\u002F特色工艺代工；先进制程(7nm及以下)受设备与EDA限制",[862,863,864,865,866,868,871,874,877,879,882,885,887,890],{"name":381,"note":162},{"name":383,"note":162},{"name":385,"note":162},{"name":106,"note":162},{"name":867,"note":162},"晶合集成",{"name":869,"note":870},"上海华力","华虹集团旗下12英寸晶圆代工",{"name":872,"note":873},"积塔半导体","特色工艺集成电路代工",{"name":875,"note":876},"芯联集成","MEMS与功率器件代工",{"name":501,"note":878},"特色工艺与三维集成代工",{"name":880,"note":881},"燕东微","8英寸与12英寸特色工艺",{"name":883,"note":884},"芯恩","青岛",{"name":525,"note":886},"西安，3D V-NAND闪存制造",{"name":888,"note":889},"龙腾半导体","8英寸功率半导体晶圆线",{"name":891,"note":892},"陕西电子芯业时代","8英寸功率半导体线",{"source":75,"experts":894,"policies":898,"chainCode":27,"aggregationZones":905},[895,896,897],{"org":84,"raw":85,"name":86,"note":87,"title":88},{"org":127,"raw":128,"name":129,"note":130,"title":131},{"org":159,"raw":160,"name":161,"note":162,"title":163},[899,900,901,902],{"raw":354,"date":355,"name":356,"doc_no":357,"issuer":358,"summary":359},{"raw":361,"date":362,"name":363,"doc_no":364,"issuer":358,"summary":365},{"raw":373,"date":374,"name":375,"doc_no":162,"issuer":376,"summary":377},{"raw":903,"date":368,"name":369,"doc_no":162,"issuer":370,"summary":904},"《产业结构调整指导目录（2024年本）》（国家发展和改革委员会，2024-02）：先进晶圆制造列入鼓励类","先进晶圆制造列入鼓励类",[906,908],{"city":223,"name":224,"note":907,"level":225},"省级规划确定的集成电路晶圆制造主要承载地",{"city":223,"name":227,"note":909,"level":225},"全国第一批国家战略性新兴产业集群","2026-10-12T14:28:52.208Z",[],{"id":913,"chainId":4,"layer":858,"segment":914,"name":914,"keyPoints":713,"companies":915,"sortOrder":551,"isKey":240,"checkState":705,"meta":940,"createdAt":953,"links":954},"cnH_E01_04","集成电路制造",[916,917,919,921,923,925,927,929,931,933,935,937,938,939],{"name":381,"note":162},{"name":918,"note":162},"华虹公司",{"name":920,"note":162},"粤芯半导体",{"name":922,"note":162},"士兰微",{"name":924,"note":162},"华润微",{"name":867,"note":926},"显示驱动芯片晶圆代工",{"name":875,"note":928},"功率器件与MEMS代工",{"name":872,"note":930},"车规级特色工艺代工",{"name":501,"note":932},"三维集成与特色工艺代工",{"name":880,"note":934},"特色工艺IDM与代工",{"name":869,"note":936},"12英寸晶圆代工",{"name":525,"note":886},{"name":888,"note":889},{"name":891,"note":892},{"source":75,"experts":941,"policies":943,"chainCode":27,"aggregationZones":950},[942],{"org":159,"raw":160,"name":161,"note":162,"title":163},[944,945,946,947],{"raw":354,"date":355,"name":356,"doc_no":357,"issuer":358,"summary":359},{"raw":361,"date":362,"name":363,"doc_no":364,"issuer":358,"summary":365},{"raw":373,"date":374,"name":375,"doc_no":162,"issuer":376,"summary":377},{"raw":948,"date":626,"name":627,"doc_no":162,"issuer":616,"summary":949},"《关于促进政府投资基金高质量发展的指导意见》（国务院办公厅，2025-01）：引导政府投资基金支持硬科技制造业","引导政府投资基金支持硬科技制造业",[951],{"city":223,"name":229,"note":952,"level":225},"功率半导体与封测集聚区","2026-10-12T14:28:52.213Z",[],{"id":956,"chainId":4,"layer":858,"segment":59,"name":59,"keyPoints":957,"companies":958,"sortOrder":556,"isKey":783,"checkState":705,"meta":994,"createdAt":1012,"links":1013},"cnH_E01_05","传统封装与先进封装(CoWoS\u002FChiplet\u002F2.5D\u002F3D)",[959,960,961,962,964,967,970,973,975,978,980,982,985,987,989,991],{"name":497,"note":162},{"name":494,"note":162},{"name":499,"note":162},{"name":963,"note":162},"甬矽电子",{"name":965,"note":966},"盛合晶微","先进封装与晶圆级封装",{"name":968,"note":969},"晶方科技","晶圆级芯片封装",{"name":971,"note":972},"颀中科技","显示驱动芯片封测",{"name":974,"note":972},"汇成股份",{"name":976,"note":977},"伟测科技","第三方集成电路测试",{"name":979,"note":977},"利扬芯片",{"name":504,"note":981},"旗下沛顿科技，存储封测",{"name":983,"note":984},"气派科技","集成电路封装测试",{"name":499,"note":986},"西安，高端集成电路封测",{"name":522,"note":988},"西安，DRAM等封装测试",{"name":525,"note":990},"西安，晶圆制造与封测一体",{"name":992,"note":993},"日月芯半导体","铜川，集成电路封装测试",{"source":75,"experts":995,"policies":1001,"chainCode":27,"aggregationZones":1007},[996],{"org":997,"raw":998,"name":999,"note":1000,"title":213},"武汉大学","刘胜（武汉大学），教授，芯片封装与可靠性专家","刘胜","芯片封装与可靠性专家",[1002,1003,1004],{"raw":361,"date":362,"name":363,"doc_no":364,"issuer":358,"summary":365},{"raw":262,"date":263,"name":264,"doc_no":162,"issuer":265,"summary":266},{"raw":1005,"date":368,"name":369,"doc_no":162,"issuer":370,"summary":1006},"《产业结构调整指导目录（2024年本）》（国家发展和改革委员会，2024-02）：先进封装测试等列入鼓励类","先进封装测试等列入鼓励类",[1008,1010],{"city":223,"name":229,"note":1009,"level":225},"华天科技带动，西部最大高端封测基地",{"city":231,"name":232,"note":1011,"level":233},"服务三星、美光、华天配套封测与材料","2026-10-12T14:28:52.218Z",[],{"id":1015,"chainId":4,"layer":816,"segment":1016,"name":1016,"keyPoints":162,"companies":1017,"sortOrder":37,"isKey":240,"checkState":705,"meta":1076,"createdAt":1092,"links":1093},"cnH_E01_06","关键设备与材料（上游）",[1018,1020,1022,1024,1026,1028,1029,1032,1035,1038,1041,1044,1047,1050,1053,1056,1059,1062,1065,1067,1070,1073],{"name":1019,"note":162},"北方华创",{"name":1021,"note":162},"中微公司",{"name":1023,"note":162},"拓荆科技",{"name":1025,"note":162},"盛美上海",{"name":1027,"note":162},"安集科技",{"name":446,"note":162},{"name":1030,"note":1031},"华海清科","CMP抛光设备",{"name":1033,"note":1034},"芯源微","涂胶显影设备",{"name":1036,"note":1037},"中科飞测","量检测设备",{"name":1039,"note":1040},"精测电子","半导体量检测设备",{"name":1042,"note":1043},"长川科技","测试设备",{"name":1045,"note":1046},"华峰测控","半导体测试系统",{"name":1048,"note":1049},"屹唐股份","干法去胶与热处理设备",{"name":1051,"note":1052},"雅克科技","前驱体与电子材料",{"name":1054,"note":1055},"鼎龙股份","CMP抛光垫与清洗液",{"name":1057,"note":1058},"恒坤新材","光刻材料与前驱体",{"name":1060,"note":1061},"至纯科技","高纯工艺系统与清洗设备",{"name":1063,"note":1064},"京仪装备","晶圆温控与废气处理设备",{"name":434,"note":1066},"12英寸电子级硅片",{"name":1068,"note":1069},"天宏瑞科","电子级粒状多晶硅",{"name":1071,"note":1072},"彩晶光电","半导体光刻胶等关键材料",{"name":1074,"note":1075},"瑞联新材","半导体光刻胶单体等",{"source":75,"experts":1077,"policies":1082,"chainCode":27,"aggregationZones":1089},[1078,1079],{"org":90,"raw":91,"name":92,"note":93,"title":94},{"org":792,"raw":1080,"name":1081,"note":113,"title":795},"尹志尧（中微半导体设备（上海）股份有限公司），中微公司创始人、董事长，刻蚀设备专家","尹志尧（中微半导体设备",[1083,1084,1085,1088],{"raw":262,"date":263,"name":264,"doc_no":162,"issuer":265,"summary":266},{"raw":250,"date":251,"name":252,"doc_no":162,"issuer":253,"summary":254},{"raw":1086,"date":368,"name":369,"doc_no":162,"issuer":370,"summary":1087},"《产业结构调整指导目录（2024年本）》（国家发展和改革委员会，2024-02）：半导体设备与材料列入鼓励类","半导体设备与材料列入鼓励类",{"raw":373,"date":374,"name":375,"doc_no":162,"issuer":376,"summary":377},[1090],{"city":223,"name":224,"note":1091,"level":225},"硅产业基地等集成电路材料集聚","2026-10-12T14:28:52.224Z",[],{"id":1095,"chainId":4,"layer":1096,"segment":1097,"name":1097,"keyPoints":1098,"companies":1099,"sortOrder":1149,"isKey":783,"checkState":705,"meta":1150,"createdAt":1158,"links":1159},"cnH_E01_07","下游","集成电路应用","消费电子 通信 汽车电子 工业控制",[1100,1102,1104,1106,1108,1110,1113,1116,1119,1122,1125,1128,1131,1134,1137,1139,1141,1144,1146],{"name":1101,"note":162},"华为",{"name":1103,"note":162},"比亚迪",{"name":1105,"note":162},"小米集团",{"name":1107,"note":162},"海康威视",{"name":1109,"note":162},"中兴通讯",{"name":1111,"note":1112},"联想集团","PC与服务器",{"name":1114,"note":1115},"京东方","显示面板",{"name":1117,"note":1118},"闻泰科技","手机ODM与终端",{"name":1120,"note":1121},"立讯精密","消费电子与通信",{"name":1123,"note":1124},"工业富联","服务器与云计算设备制造",{"name":1126,"note":1127},"浪潮信息","AI服务器",{"name":1129,"note":1130},"大华股份","智慧物联与安防",{"name":1132,"note":1133},"大疆","无人机与影像设备",{"name":1135,"note":1136},"蔚来","智能电动汽车",{"name":1138,"note":1136},"理想汽车",{"name":1103,"note":1140},"西安基地，新能源汽车",{"name":1142,"note":1143},"隆基绿能","西安，光伏逆变应用",{"name":1109,"note":1145},"西安，通信与终端",{"name":1147,"note":1148},"长安计算","西安，信创整机",6,{"source":75,"experts":1151,"policies":1152,"chainCode":27,"aggregationZones":1157},[],[1153,1154],{"raw":598,"date":483,"name":599,"doc_no":162,"issuer":600,"summary":601},{"raw":1155,"date":483,"name":484,"doc_no":162,"issuer":485,"summary":1156},"《关于深入实施“人工智能+”行动的意见》（国务院，2025-08）：推动人工智能与产业深度融合，扩大芯片应用需求","推动人工智能与产业深度融合，扩大芯片应用需求",[],"2026-10-12T14:28:52.229Z",[],{"id":1161,"chainId":4,"layer":816,"segment":676,"name":676,"keyPoints":1162,"companies":1163,"sortOrder":40,"isKey":240,"checkState":705,"meta":1188,"createdAt":1198,"links":1199},"cnH_E01_08","光刻机 刻蚀机 PVD\u002FCVD 离子注入机",[1164,1165,1166,1167,1168,1170,1171,1172,1173,1175,1177,1179,1182,1184,1185],{"name":1019,"note":162},{"name":1021,"note":162},{"name":1023,"note":162},{"name":1025,"note":162},{"name":1030,"note":1169},"CMP设备",{"name":1033,"note":1034},{"name":1036,"note":1037},{"name":1039,"note":1040},{"name":1042,"note":1174},"测试机与分选机",{"name":1045,"note":1176},"模拟与混合信号测试系统",{"name":1060,"note":1178},"湿法清洗设备",{"name":1180,"note":1181},"万业企业","旗下凯世通，离子注入机",{"name":1048,"note":1183},"干法去胶与快速热处理设备",{"name":1063,"note":1064},{"name":1186,"note":1187},"新凯来","刻蚀、薄膜等多品类设备",{"source":75,"experts":1189,"policies":1192,"chainCode":27,"aggregationZones":1197},[1190,1191],{"org":90,"raw":91,"name":92,"note":93,"title":94},{"org":792,"raw":1080,"name":1081,"note":113,"title":795},[1193,1194],{"raw":262,"date":263,"name":264,"doc_no":162,"issuer":265,"summary":266},{"raw":1195,"date":374,"name":375,"doc_no":162,"issuer":376,"summary":1196},"《关于提高集成电路和工业母机企业研发费用加计扣除比例的公告》（财政部等四部门，2023-08）：集成电路设备企业研发费用加计扣除比例提高至120%","集成电路设备企业研发费用加计扣除比例提高至120%",[],"2026-10-12T14:28:52.233Z",[],{"id":1201,"chainId":4,"layer":711,"segment":1202,"name":1202,"keyPoints":1203,"companies":1204,"sortOrder":1232,"isKey":783,"checkState":705,"meta":1233,"createdAt":1247,"links":1248},"cnH_E01_09","EDA\u002FIP","设计\u002F仿真\u002F晶圆测试EDA工具，高端EDA与先进工艺绑定为卡脖子环节",[1205,1206,1207,1208,1209,1210,1212,1215,1217,1218,1219,1221,1222,1223,1226,1229],{"name":317,"note":162},{"name":319,"note":162},{"name":325,"note":162},{"name":321,"note":162},{"name":323,"note":162},{"name":1211,"note":162},"东方晶源",{"name":1213,"note":1214},"芯原股份","半导体IP与设计服务",{"name":327,"note":1216},"数字验证EDA",{"name":330,"note":331},{"name":333,"note":334},{"name":336,"note":1220},"仿真与封装EDA",{"name":339,"note":340},{"name":342,"note":343},{"name":1224,"note":1225},"安谋科技","处理器IP",{"name":1227,"note":1228},"锐成芯微","嵌入式存储等IP",{"name":1230,"note":1231},"灿芯股份","一站式芯片设计服务",8,{"source":75,"experts":1234,"policies":1237,"chainCode":27,"aggregationZones":1246},[1235,1236],{"org":101,"raw":102,"name":103,"note":104,"title":94},{"org":165,"raw":171,"name":172,"note":173,"title":174},[1238,1239,1240,1243],{"raw":262,"date":263,"name":264,"doc_no":162,"issuer":265,"summary":266},{"raw":250,"date":251,"name":252,"doc_no":162,"issuer":253,"summary":254},{"raw":1241,"date":368,"name":369,"doc_no":162,"issuer":370,"summary":1242},"《产业结构调整指导目录（2024年本）》（国家发展和改革委员会，2024-02）：EDA软件与IP核列入鼓励类","EDA软件与IP核列入鼓励类",{"raw":1244,"date":269,"name":270,"doc_no":162,"issuer":271,"summary":1245},"《关于推动未来产业创新发展的实施意见》（工业和信息化部等七部门，2024-01）：强化基础软件与工具链创新","强化基础软件与工具链创新",[],"2026-10-12T14:28:52.238Z",[],{"id":1250,"chainId":4,"layer":711,"segment":683,"name":683,"keyPoints":1251,"companies":1252,"sortOrder":1294,"isKey":783,"checkState":705,"meta":1295,"createdAt":1307,"links":1308},"cnH_E01_10","硅片(大尺寸)、光刻胶、电子特气、湿电子化学品、靶材、CMP材料；高端光刻胶\u002F大硅片国产化率低",[1253,1254,1255,1256,1257,1258,1260,1261,1262,1264,1267,1270,1273,1276,1279,1282,1283,1284,1287,1289,1290,1292],{"name":446,"note":162},{"name":434,"note":162},{"name":449,"note":450},{"name":452,"note":453},{"name":455,"note":162},{"name":1027,"note":1259},"CMP抛光液",{"name":1054,"note":1055},{"name":1057,"note":1058},{"name":1051,"note":1263},"前驱体与电子特气",{"name":1265,"note":1266},"南大光电","电子特气与光刻胶",{"name":1268,"note":1269},"华特气体","电子特种气体",{"name":1271,"note":1272},"江化微","湿电子化学品",{"name":1274,"note":1275},"晶瑞电材","光刻胶与湿电子化学品",{"name":1277,"note":1278},"彤程新材","光刻胶，旗下北京科华",{"name":1280,"note":1281},"上海新阳","电镀液与清洗液",{"name":457,"note":458},{"name":460,"note":458},{"name":1285,"note":1286},"江丰电子","高纯溅射靶材",{"name":434,"note":1288},"12英寸硅抛光片\u002F外延片",{"name":1068,"note":1069},{"name":1074,"note":1291},"光刻胶单体、TFT平坦层光刻胶",{"name":1071,"note":1293},"半导体光刻胶与光引发剂",9,{"source":75,"experts":1296,"policies":1299,"chainCode":27,"aggregationZones":1304},[1297,1298],{"org":127,"raw":133,"name":134,"note":135,"title":88},{"org":137,"raw":138,"name":139,"note":140,"title":131},[1300,1301],{"raw":354,"date":355,"name":356,"doc_no":357,"issuer":358,"summary":359},{"raw":1302,"date":368,"name":369,"doc_no":162,"issuer":370,"summary":1303},"《产业结构调整指导目录（2024年本）》（国家发展和改革委员会，2024-02）：电子级硅材料、光刻胶等半导体材料列入鼓励类","电子级硅材料、光刻胶等半导体材料列入鼓励类",[1305],{"city":223,"name":224,"note":1306,"level":225},"大硅片与电子材料集群化发展","2026-10-12T14:28:52.243Z",[],{"id":1310,"chainId":4,"layer":711,"segment":1311,"name":1311,"keyPoints":1312,"companies":1313,"sortOrder":1341,"isKey":783,"checkState":705,"meta":1342,"createdAt":1346,"links":1347},"cnH_E01_11","洁净厂务","洁净室工程、高纯工艺系统、废气废水处理、厂务设备",[1314,1316,1318,1320,1322,1324,1327,1329,1332,1335,1338],{"name":1315,"note":162},"亚翔集成",{"name":1317,"note":162},"圣晖集成",{"name":1319,"note":162},"柏诚股份",{"name":1321,"note":162},"深桑达A",{"name":507,"note":1323},"十一科技",{"name":1325,"note":1326},"正帆科技","工艺介质供应系统",{"name":1060,"note":1328},"高纯工艺系统",{"name":1330,"note":1331},"中电四公司","半导体洁净厂房工程总承包",{"name":1333,"note":1334},"中电二公司","高科技工程洁净厂房建设",{"name":1336,"note":1337},"美埃科技","洁净室空气过滤设备",{"name":1339,"note":1340},"苏净集团","洁净工程与洁净设备",10,{"source":75,"experts":1343,"policies":1344,"chainCode":27,"aggregationZones":1345},[],[],[],"2026-10-12T14:28:52.248Z",[],{"id":1349,"chainId":4,"layer":858,"segment":1350,"name":1350,"keyPoints":1351,"companies":1352,"sortOrder":1380,"isKey":783,"checkState":705,"meta":1381,"createdAt":1387,"links":1388},"cnH_E01_12","IDM","设计制造封测一体化，功率半导体\u002F特色工艺为主",[1353,1354,1355,1356,1357,1359,1362,1365,1368,1370,1373,1375,1377],{"name":922,"note":162},{"name":924,"note":162},{"name":385,"note":162},{"name":106,"note":162},{"name":1117,"note":1358},"旗下安世半导体，功率器件IDM",{"name":1360,"note":1361},"时代电气","中车时代半导体，IGBT IDM",{"name":1363,"note":1364},"比亚迪半导体","车规功率器件IDM",{"name":1366,"note":1367},"扬杰科技","功率半导体IDM",{"name":1369,"note":1367},"华微电子",{"name":1371,"note":1372},"捷捷微电","功率器件IDM",{"name":525,"note":1374},"西安，存储芯片IDM工厂",{"name":888,"note":1376},"功率半导体全链条IDM",{"name":1378,"note":1379},"派瑞股份","西安，功率半导体器件",11,{"source":75,"experts":1382,"policies":1385,"chainCode":27,"aggregationZones":1386},[1383,1384],{"org":96,"raw":97,"name":98,"note":99,"title":94},{"org":473,"raw":474,"name":475,"note":476,"title":477},[],[],"2026-10-12T14:28:52.253Z",[],{"chainId":4,"chainName":5,"matchedTagNames":1390,"experts":1391,"achievements":1393,"topUniversities":1395,"note":1396},[],{"count":782,"items":1392},[],{"count":782,"items":1394},[],[],"无标签映射",{"hasMapping":240,"chainId":4,"industry":1398,"industryCode":1399,"confidence":1400,"source":1401,"totals":1403,"segments":1410},"印制板PCB","I12","suggested",{"source_text":1402,"source_url":109},"工信部指导、赛迪研究院《制造业数字化转型参考指引(2025版)》",{"scenarios":1404,"rated":1405,"tools":1406,"knowledgeModels":1407,"dataElements":1408,"talentSkills":1409},43,18,53,65,94,64,[1411,1597,1755],{"segment":1412,"segment_code":1413,"activity_group":1414,"scenarios":1415},"行业不同环节","B","供应链管理",[1416,1423,1430,1437,1445,1453,1461,1469,1476,1484,1514,1555,1562,1569,1576,1583,1590],{"scenario_code":1417,"scenario_name":1418,"rating":162,"pain_text":109,"tools":1419,"knowledge_models":1420,"data_elements":1421,"talent_skills":1422},"SJ02-B-5-1","PCB供应链数字化管理",[],[],[],[],{"scenario_code":1424,"scenario_name":1425,"rating":162,"pain_text":109,"tools":1426,"knowledge_models":1427,"data_elements":1428,"talent_skills":1429},"SJ02-B-5-2","PCB供应链全流程质量追溯",[],[],[],[],{"scenario_code":1431,"scenario_name":1432,"rating":162,"pain_text":109,"tools":1433,"knowledge_models":1434,"data_elements":1435,"talent_skills":1436},"SJ02-B-2-1","PCB智能化生产管理",[],[],[],[],{"scenario_code":1438,"scenario_name":1439,"rating":546,"pain_text":1440,"tools":1441,"knowledge_models":1442,"data_elements":1443,"talent_skills":1444},"SJ02-B-2-2","PCB智能生产计划排程","钻孔过程中涉及工艺方案、刀具、设备等众多影响因素，数据管理能力不足，加工质量管控难度大",[],[],[],[],{"scenario_code":1446,"scenario_name":1447,"rating":551,"pain_text":1448,"tools":1449,"knowledge_models":1450,"data_elements":1451,"talent_skills":1452},"SJ02-B-2-3","PCB钻孔工艺数字化管控","缺少高质量缺陷图像数据集，模型训练缺少参照，检测识别精度不高",[],[],[],[],{"scenario_code":1454,"scenario_name":1455,"rating":546,"pain_text":1456,"tools":1457,"knowledge_models":1458,"data_elements":1459,"talent_skills":1460},"SJ02-B-2-4","PCB压合工艺数字化管控","PCB镀铜工艺、蚀刻线路精度要求越来越高，孔壁毛刺、层间剥离等内部缺陷缺乏快速评价和优化手段，工艺质量把控难度大，各化学工序数据分散在不同的系统或数据库中，缺乏有效整合和共享机制",[],[],[],[],{"scenario_code":1462,"scenario_name":1463,"rating":546,"pain_text":1464,"tools":1465,"knowledge_models":1466,"data_elements":1467,"talent_skills":1468},"SJ02-B-2-5","PCB化学工艺数字化管控","PCB清洗工序的数字化水平低，用水消耗大，基于人工经验进行出水参数调控效率较低",[],[],[],[],{"scenario_code":1470,"scenario_name":1471,"rating":162,"pain_text":109,"tools":1472,"knowledge_models":1473,"data_elements":1474,"talent_skills":1475},"SJ02-B-2-6","PCB制造过程能源管控",[],[],[],[],{"scenario_code":1477,"scenario_name":1478,"rating":551,"pain_text":1479,"tools":1480,"knowledge_models":1481,"data_elements":1482,"talent_skills":1483},"SJ02-B-2-7","PCB智能控水节水","目前单台生产设备能耗普遍未实现自动采集，且设备有效工作时长难以统计，导致设备能耗管理模式较为粗放，能耗优化存在一定难度",[],[],[],[],{"scenario_code":1485,"scenario_name":1486,"rating":551,"pain_text":1487,"tools":1488,"knowledge_models":1494,"data_elements":1499,"talent_skills":1508},"SJ02-B-1-1","PCB数字化工艺设计","与生产环节数据交互不足，存在数据孤岛现象；缺乏统一的研发文件分析处理规范，导致研发设计过程中文档的处理效率低下；PCB化学工艺的药水配方质量数据采集程度不高，仍需依赖人工经验分析，影响化学工艺研发效率；高密度多层板的压合质量评价体系和优化机制缺乏，无法根据工艺参数与产品质量之间关联",[1489,1490,1491,1492,1493],"CAE软件","失效模式分析工具","失效物理设计仿真软件","CAM软件","PLM系统和自动测试系统",[1495,1496,1497,1498],"PCB电路设计模型","PCB三维结构模型","Gber文件转化模型","物理仿真模型",[1500,1501,1502,1503,1504,1505,1506,1507],"PCB设计规范","仿真材料参数","原理图","BOM清单","尺寸参数","布线布局数据","仿真性能数据","测试验证数据等",[1509,1510,1511,1512,1513],"电子信息","电子材料","电路设计仿真","自动化控制","嵌入式应用与开发",{"scenario_code":1515,"scenario_name":1516,"rating":541,"pain_text":1517,"tools":1518,"knowledge_models":1526,"data_elements":1536,"talent_skills":1548},"SJ02-B-1-2","基于AI技术的PCB制前工程管理","国内印制板(PCB)行业协同研发设计工具主要依赖海外厂商，无法完全适应国内产业链需求，行业研发设计变更管理复杂数字化协同研发印制板(PCB)行业数字化转型场景图谱（2025版）（1\u002F2）A覆铜板等材料环节B印制板(PCB)环节C印制板组装件(PCBA)环节提质降本提质降本；存在各系统集成困难，与企业生产控制系统兼容性欠佳的问题数字化协同制造；不同生产环节存在数据壁垒，设备数据采集能力不足，对生产过程质量的感知能力不佳设备在线智能反控能力不足，缺乏根据质量、效率优化需求自主调整生产工艺参数能力；生产工单多变、工艺流程长、工序类型众多，生产计划排程复杂多变，易导致产品物料、生产资源错配的情况；PCBA客户厂商提供的Gerber文件在转化成检测标准模版、MI指示文件、CAM工程文件等过程面临大量差异化的处理需求，且文件类型、数量众多，且目前主要依赖人工进行文档分析处理和本地化管理，容易产生文件版本管理混乱、丢失错放等问题，影响产品工艺研发进度",[1519,1520,1521,1519,1522,1523,1524,1525],"MES系统","ERP系统","WMS系统","ERP系统，CAM软件","APS系统","能源管理系统","AOI检测系统及QMS系统",[1527,1528,1529,1530,1531,1532,1533,1528,1534,1535],"混胶配比模型","质量数据分析模型","生产物料管理模型","物料防错追溯模型","生产资源调度模型","智能节水模型","表面质量检测模型","钻孔刀具管理模型","工艺性能评估优化模型等",[1537,1538,1539,1540,1541,1542,1543,1540,1544,1538,1545,1546,1547],"设备数据","工艺参数","生产计划数据","质检数据","工艺过程状态数据","物料仓储数据","工单数据","物料数据","设备运行数据","设备能耗数据","MI知识文档等",[1510,1549,1550,1551,1552,1553,1554],"生产管理","质量数据分析","PCB材料","电学测试分析","生产工艺优化技术","PCB分析测试测试技能",{"scenario_code":1556,"scenario_name":1557,"rating":162,"pain_text":109,"tools":1558,"knowledge_models":1559,"data_elements":1560,"talent_skills":1561},"SJ02-B-4-1","PCB智能化经营管理",[],[],[],[],{"scenario_code":1563,"scenario_name":1564,"rating":162,"pain_text":109,"tools":1565,"knowledge_models":1566,"data_elements":1567,"talent_skills":1568},"SJ02-B-4-2","基于供需对接平台的PCB敏捷交付",[],[],[],[],{"scenario_code":1570,"scenario_name":1571,"rating":162,"pain_text":109,"tools":1572,"knowledge_models":1573,"data_elements":1574,"talent_skills":1575},"SJ02-B-4-3","PCB数字化库存管理",[],[],[],[],{"scenario_code":1577,"scenario_name":1578,"rating":162,"pain_text":109,"tools":1579,"knowledge_models":1580,"data_elements":1581,"talent_skills":1582},"SJ02-B-4-4","PCB智能资产管理",[],[],[],[],{"scenario_code":1584,"scenario_name":1585,"rating":162,"pain_text":109,"tools":1586,"knowledge_models":1587,"data_elements":1588,"talent_skills":1589},"SJ02-B-3-1","PCB售后服务",[],[],[],[],{"scenario_code":1591,"scenario_name":1592,"rating":162,"pain_text":109,"tools":1593,"knowledge_models":1594,"data_elements":1595,"talent_skills":1596},"SJ02-B-3-2","PCB客户价值分析",[],[],[],[],{"segment":1598,"segment_code":1599,"activity_group":1414,"scenarios":1600},"覆铜板等材料环节","A",[1601,1639,1646,1653,1674,1716],{"scenario_code":1602,"scenario_name":1603,"rating":551,"pain_text":1604,"tools":1605,"knowledge_models":1612,"data_elements":1618,"talent_skills":1629},"SJ02-A-5-1","覆铜板供应链数字化管理","供应链质量信息采集不足、缺乏供应链自主优化机制；管控过程依赖人工，效率较低；风险管理不足、应急预案制定不合理；PCB涉及物料众多，但目前物料数据采集基础较为薄弱，造成目前产品质量追溯尚无法精确溯源具体物料，供应链质量管控存在一定风险；供应链上下游协同数字化程度低，信息传递时效低、难以追溯，无法及时进行供应业务对接；电子元器件数据管理分散，选型缺乏数据驱动的数字化工具和元器件质量分级分类规范，选型质量需求难保障，难以支撑元器件的精准供需对接服务；缺乏数据驱动的PCBA供应链风险监控，断供停产禁运等风险难以把控国产化替代缺乏数据支撑，供应链自主可控程度低；PCBA上下游配套协作关系复杂且多维时空质量信息动态交变耦合，导致产业链全过程质量追溯不畅n；不同环节厂商的信息共享和透明度不足，无法通过系统的联动实现供应链计划协同；供应链数据来源多样、格式不一造成数据整合与分析难度较大",[1606,1607,1606,1521,1608,1606,1609,1610,1611],"SRM系统","WMS系统等","MES系统等","BOM配单系统","元器件全寿命数据资源管理平台","供应链风险管控平台等",[1613,1614,1615,1613,1614,1615,1613,1614,1616,1617],"供应链成本分析模型","供应链质量分析模型","供应商综合评价模型等","供应商综合评价模型","供应链风险评价模型等",[1619,1620,1621,1622,1623,1624,1625,1619,1620,1621,1622,1623,1624,1625,1626,1627,1628],"原材料采购数据","生产计划与调度数据","生产过程控制数据","物流管理数据","成本管理数据","客户关系管理数据","供应链协同数据等","供应商信息","终端产品需求数据","PCBA研发\u002F制造\u002F销售\u002F仓储\u002F物流等全流程数据等",[1630,1631,1632,1633,1414,1634,1630,1631,1632,1633,1414,1635,1636,1637,1634,1638],"物流管理","电子商务","国际贸易","信息管理与信息系统","财务管理等专业技能","数据库技术","工商管理","市场营销","具备数字化技能和供应链知识，能够推动数字化技术与供应链管理深度融合的复合型人才",{"scenario_code":1640,"scenario_name":1641,"rating":162,"pain_text":109,"tools":1642,"knowledge_models":1643,"data_elements":1644,"talent_skills":1645},"SJ02-A-2-1","覆铜板数字化生产制造",[],[],[],[],{"scenario_code":1647,"scenario_name":1648,"rating":162,"pain_text":109,"tools":1649,"knowledge_models":1650,"data_elements":1651,"talent_skills":1652},"SJ02-A-2-2","覆铜板原料混胶配比的数字化控制",[],[],[],[],{"scenario_code":1654,"scenario_name":1655,"rating":546,"pain_text":1656,"tools":1657,"knowledge_models":1659,"data_elements":1664,"talent_skills":1670},"SJ02-A-1-1","覆铜板数字化研发","数据基础建设相对落后，产品性能要求与设计能力不匹配，存在材料性能适配困难、原型验证效率低下等问题",[1658,1489],"EDA软件",[1660,1661,1662,1663],"三维设计模型","热仿真模型","振动仿真模型","覆铜功能验证模型",[1665,1666,1667,1668,1506,1669],"材料参数","BOM表","设计参数","设计图纸","试验验证数据等",[1671,1672,1673],"材料科学与研发","电路设计","物理仿真",{"scenario_code":1675,"scenario_name":1676,"rating":551,"pain_text":1677,"tools":1678,"knowledge_models":1681,"data_elements":1693,"talent_skills":1707},"SJ02-A-4-1","覆铜板智能化经营管理","缺乏动态成本效益分析模型，在订单报价、采购策略制定等方面缺乏根据与成本、生产效益目标关联规则，导致当前企业经营管理业务尚存需依赖人工，增加了管理成本；经营管理系统智能化程度不足，在审批流程发起、系统信息交互等层面存在效率不足、响应时间滞后等情况；产品需求对接不够精确，生产、设计、采购、测试等部门的信息对接不畅，容易导致生产延误等问题；通用型PCB库存周转率低，物料管控精细度不足，缺乏根据需求数据降低呆滞库存的能力；计划库存订单多级业务协同能力不足，供应对接及时性仍需提升；仓储与配送优化缺少数据测算与模拟仿真，无法为仓储与配送的效率优化提供数据支撑与决策；采购需求与生产计划动态匹配不足，无法满足个性化、柔性化生产动态采购优化需求；企业生产、检测等设备资产数据更新效率低，设备维护、维修、报废计划依赖人工，缺乏自主决策机制n；PCBA不同环节厂商信息管理系统数据表达规则、编码格式的差异，在进行产品生产、库存、交付等数据共享时，容易造成数据映射错误",[1520,1607,1520,1521,1679,1520,1519,1521,1606,1680],"EAM系统等","WCS系统等",[1682,1683,1684,1685,1686,1684,1687,1688,1689,1690,1691,1692],"设备效益分析模型","原材料价格趋势分析模型","成本分析模型","设备综合效率分析模型","市场趋势分析模型","员工绩效评估模型","PESTEL分析模型","物料采购模型","仓储模型","客户画像","市场趋势分析模型等",[1694,1695,1696,1697,1694,1698,1696,1697,1699,1700,1701,1702,1703,1704,1705,1706],"财务数据","生产物料成本数据","销售数据","生产与运营数据","生产成本数据","人力资源数据","项目管理数据","订单数据","动态库存","销售订单","物料需求","生产计划","供货计划等",[1708,1709,1710,1711,1708,1709,1710,1711,1712,1713,1714,1715],"数据挖掘分析","商业管理与决策","成本管控优化","商业规划与管理","需要具备销售与市场营销","采购与供应链管理","生产与技术","数据分析与信息化管理等能力",{"scenario_code":1717,"scenario_name":1718,"rating":551,"pain_text":1719,"tools":1720,"knowledge_models":1722,"data_elements":1733,"talent_skills":1745},"SJ02-A-3-1","覆铜板售后服务","客户信息数据采集不完整、售后服务数据分析和利用不足，导致售后服务系统响应不及时数字化协同服务；龙头企业建立较为完善的售后服务体系，中小企业缺乏标准售后流程、售后质量参差不齐；客户数据基础薄弱，缺乏客户潜在需求等数据支持，难以对客户进行精细化划分、难以提供个性化的服务和产品推荐；客服数据精细化管理与深度挖掘不足，基于大数据动态跟踪用户服务需求的能力仍需提升；客户数据采集不全，在客户潜在需求等领域缺乏足够数据支持，难以对客户进行精细化划分、难以提供个性化的服务和产品推荐n；PCB行业不同环节厂商的信息管理系统难以打通，仅能实现整体数据查看权限的开放，无法对数据进行融合分析，存在一定信息孤岛",[1721,1721,1721],"CRM系统",[1723,1724,1725,1726,1727,1728,1729,1730,1731,1732],"故障率分析模型","客户满意度分析模型","售后服务率分析模型","质量成本控制模型等","订单分析模型","客户关系管理模型","RFM模型","客户信用评价模型等","客户需求模型","主动服务模型等",[1734,1735,1736,1737,1738,1739,1740,1741,1742,1735,1743,1744],"产品性能数据","客户反馈","售后服务数据","客户基本信息","产品信息","服务记录","客户反馈意见等","客户服务信息","维修记录","客户服务知识库","产品性能数据等",[1746,1747,1748,1637,1749,1750,1751,1752,1753,1512,1754],"客户关系维护","覆铜板故障模式","客户分析画像","商业分析","具备扎实的电子电路知识，了解各种元器件的特性和功能","熟悉常见的电路板布局和设计原理","能够迅速解决客户在使用过程中遇到的技术问题和质量问题","需要具备专业的电子工程","计算机科学等多学科知识",{"segment":162,"segment_code":1756,"activity_group":1414,"scenarios":1757},"C",[1758,1765,1772,1779,1786,1793,1823,1843,1851,1859,1867,1875,1882,1906,1913,1920,1927,1934,1941,1948],{"scenario_code":1759,"scenario_name":1760,"rating":162,"pain_text":109,"tools":1761,"knowledge_models":1762,"data_elements":1763,"talent_skills":1764},"SJ02-C-5-1","PCBA供应链管理",[],[],[],[],{"scenario_code":1766,"scenario_name":1767,"rating":162,"pain_text":109,"tools":1768,"knowledge_models":1769,"data_elements":1770,"talent_skills":1771},"SJ02-C-5-2","元器件智能选型与供需对接",[],[],[],[],{"scenario_code":1773,"scenario_name":1774,"rating":162,"pain_text":109,"tools":1775,"knowledge_models":1776,"data_elements":1777,"talent_skills":1778},"SJ02-C-5-3","PCBA供应链风险管控",[],[],[],[],{"scenario_code":1780,"scenario_name":1781,"rating":162,"pain_text":109,"tools":1782,"knowledge_models":1783,"data_elements":1784,"talent_skills":1785},"SJ02-C-5-4","PCBA供应链全过程质量追溯管理提质降本提质研、产、管、服数字化集成",[],[],[],[],{"scenario_code":1787,"scenario_name":1788,"rating":162,"pain_text":109,"tools":1789,"knowledge_models":1790,"data_elements":1791,"talent_skills":1792},"SJ02-C-2-1","PCBA全流程生产工艺管控节能",[],[],[],[],{"scenario_code":1794,"scenario_name":1795,"rating":551,"pain_text":1796,"tools":1797,"knowledge_models":1801,"data_elements":1808,"talent_skills":1818},"SJ02-C-2-2","PCBA数字化质量管控","多源异构数据融合困难、仿真测试数据分析能力不足，缺乏失效机理和工艺的关联分析模型；PCBA设计中需考虑功能的实现以及在多个物理场的性能表现，如在电磁场、热场和机械场应力的相互作用，多物理场耦合仿真复杂度高、现有仿真模型存在大量物性参数难以获取，导致仿真效果不佳的问题",[1798,1799,1520,1800],"智能缺陷识别系统","QMS系统","自动测试系统",[1802,1528,1803,1804,1805,1806,1807],"板上器件BOM模型","质量控制模型","视觉检测模型","电磁兼容性模型","回流焊质量预测优化模型","印刷工艺参数优化模型等",[1809,1810,1503,1811,1812,1813,1814,1815,1816,1817],"AOI测试数据","SPI锡膏检测数据","ICT测试数据","FCT测试数据","老化测试数据","跌落测试数据","振动测试数据","盐雾测试数据","工艺失效模式库等",[1819,1820,1821,1822],"熟悉ICT测试","AOI测试","X-Ray测试等相关测试设备和流程","具备数据处理与分析的能力",{"scenario_code":1824,"scenario_name":1825,"rating":551,"pain_text":1826,"tools":1827,"knowledge_models":1830,"data_elements":1834,"talent_skills":1839},"SJ02-C-2-3","基于CPS的SMT工艺仿真测试","受成本、时间和资源的限制，设备模型、加工过程仿真模型颗粒度不足，工艺仿真结果参考性不足；面对紧急插单、设备故障等突发事件造成的生产计划调整，现有数字化工具快速形成生产计划调整方案的能力不足；贴片精度、质量等数据的实时采集机制尚不成熟，增加了工艺自主优化的难度",[1519,1828,1523,1829],"生产过程仿真工具","ERP系统等",[1831,1832,1833],"智能排产模型","生产过程仿真模型","物料供应模型等",[1835,1544,1836,1503,1837,1838],"三维模型数据","SMT产线设备运行数据","工艺参数数据","检验检测数据等",[1840,1841,1842],"熟悉SMT贴片工艺","了解各种SMT生产设备和工具","掌握SMT质量控制标准等",{"scenario_code":1844,"scenario_name":1845,"rating":546,"pain_text":1846,"tools":1847,"knowledge_models":1848,"data_elements":1849,"talent_skills":1850},"SJ02-C-2-4","SMT柔性协同化生产节能","不同分析软件工具数据不兼容，数据交互困难，影响DFM流程的顺畅进行；可制造性设计功能仍存在短板，在难以保障PCBA器件布局方案的合理性",[],[],[],[],{"scenario_code":1852,"scenario_name":1853,"rating":551,"pain_text":1854,"tools":1855,"knowledge_models":1856,"data_elements":1857,"talent_skills":1858},"SJ02-C-2-5","智能贴片工艺优化","缺乏根据产品类型自动编写测试程序的能力，自动测试效率有待提升",[],[],[],[],{"scenario_code":1860,"scenario_name":1861,"rating":546,"pain_text":1862,"tools":1863,"knowledge_models":1864,"data_elements":1865,"talent_skills":1866},"SJ02-C-2-6","基于机器视觉的PCBA表面缺陷检测","由于覆铜板原料性质差异、混胶过程中的不确定性因素（如温度、粘度等）以及设备精度限制等原因，混胶配比的精确控制难度较大，数字化管控能力不足",[],[],[],[],{"scenario_code":1868,"scenario_name":1869,"rating":551,"pain_text":1870,"tools":1871,"knowledge_models":1872,"data_elements":1873,"talent_skills":1874},"SJ02-C-2-7","基于自动测试技术的PCBA功能异常检测","SMT工艺中使用大量多品种的小型电子元器件，特征相似，生产过程中物料转送的失误容易导致元器件错装",[],[],[],[],{"scenario_code":1876,"scenario_name":1877,"rating":162,"pain_text":109,"tools":1878,"knowledge_models":1879,"data_elements":1880,"talent_skills":1881},"SJ02-C-2-8","SMT生产过程物料防错管理提质降本提质节能提质降本节能",[],[],[],[],{"scenario_code":1883,"scenario_name":1884,"rating":551,"pain_text":1885,"tools":1886,"knowledge_models":1889,"data_elements":1895,"talent_skills":1902},"SJ02-C-1-1","未命名场景·SJ02-C-1-1","PCB行业不同环节的数据共享机制已逐步完善，但仍存在生产计划变更过程难协调、数据交互不够深入的问题；国产研发设计工具的成熟度有限、多物理场耦合分析能力不足",[1658,1887,1489,1492,1888,1490,1491,1493],"CAD软件","DFM分析工具",[1890,1891,1892,1893,1894],"PCBA电路设计模型","PCBA结构设计模型","机械设计模型","功能测试模型","EMC模型等",[1896,1897,1898,1899,1900,1901],"产品结构参数","测试程序与测试规范","组装结构图","散热设计文件","接口定义文件","PCBA设计规范等",[1903,1904,1905],"电子工程","材料科学","机械设计及其自动化等",{"scenario_code":1907,"scenario_name":1908,"rating":162,"pain_text":109,"tools":1909,"knowledge_models":1910,"data_elements":1911,"talent_skills":1912},"SJ02-C-1-2","PCBA设计仿真验证",[],[],[],[],{"scenario_code":1914,"scenario_name":1915,"rating":162,"pain_text":109,"tools":1916,"knowledge_models":1917,"data_elements":1918,"talent_skills":1919},"SJ02-C-1-3","数字化可制造性设计分析",[],[],[],[],{"scenario_code":1921,"scenario_name":1922,"rating":162,"pain_text":109,"tools":1923,"knowledge_models":1924,"data_elements":1925,"talent_skills":1926},"SJ02-C-4-1","PCBA进销存一体化",[],[],[],[],{"scenario_code":1928,"scenario_name":1929,"rating":162,"pain_text":109,"tools":1930,"knowledge_models":1931,"data_elements":1932,"talent_skills":1933},"SJ02-C-4-2","智能仓储配送",[],[],[],[],{"scenario_code":1935,"scenario_name":1936,"rating":162,"pain_text":109,"tools":1937,"knowledge_models":1938,"data_elements":1939,"talent_skills":1940},"SJ02-C-4-3","采购计划协同优化",[],[],[],[],{"scenario_code":1942,"scenario_name":1943,"rating":162,"pain_text":109,"tools":1944,"knowledge_models":1945,"data_elements":1946,"talent_skills":1947},"SJ02-C-3-1","PCBA售后服务",[],[],[],[],{"scenario_code":1949,"scenario_name":1950,"rating":162,"pain_text":109,"tools":1951,"knowledge_models":1952,"data_elements":1953,"talent_skills":1954},"SJ02-C-3-2","PCBA交付全流程可视化增效降本提质节能提质降本提质降本提质降本提质降本增效降本提质提质增效降本提质提质提质降本提质降本增效降本增效降本增效降本节能降本节能节能降本提质提质提质提质增效印制板(PCB)行业数字化转型场景图谱（2025版）（2\u002F2）A覆铜板等材料环节B印制板(PCB)环节C印制板组装件(PCBA)环节",[],[],[],[],[1956,1958,1960,1962,1964,1966,1968,1970,1972,1974,1976,1978,1980,1982,1984,1986,1988,1990,1992,1994,1996,1998,2000,2002,2004],{"name":80,"id":1957},"cmv7rhq7c0199hikye73g7hc7",{"name":86,"id":1959},"cmv7rhq7i019ehikyijfs1coi",{"name":92,"id":1961},"cmv7rhq7o019jhiky2jl8b60n",{"name":98,"id":1963},"cmv7rhq7u019ohikygz8neyb4",{"name":103,"id":1965},"cmv7rhq7z019thikyf1q2wqif",{"name":107,"id":1967},"cmv7rhq84019yhikyjzovvv9a",{"name":112,"id":1969},"cmv7rhq8901a3hikyzdbkk5gg",{"name":117,"id":1971},"cmv7rhq8e01a8hikytra24m2u",{"name":123,"id":1973},"cmv7rhq8k01adhikyl1atg95p",{"name":129,"id":1975},"cbe70e89-69b6-4f93-890a-e4d3209a3c92",{"name":134,"id":1977},"afe53b56-3365-47f1-b4ed-6df88d0744e2",{"name":139,"id":1979},"cmv7rhq8p01aihiky4osy3xnj",{"name":143,"id":1981},"510a3c1f-168e-46b7-8691-d1fb3cd19e3b",{"name":149,"id":1983},"cmv7rhq0z012vhiky7w0g7tuv",{"name":155,"id":1985},"cmv7rhq8v01anhikylgmp2oy6",{"name":161,"id":1987},"cmv7rhq9001ashiky2nksw5kz",{"name":167,"id":1989},"14a94f13-0221-4b90-9c2b-0bc0dab81351",{"name":172,"id":1991},"7493c6f3-122a-4b2a-b026-3be8f6b383dc",{"name":178,"id":1993},"e5c78090-eff8-4746-bbf8-cdc89264138b",{"name":184,"id":1995},"f039bda0-1317-4052-9353-051854a45f37",{"name":189,"id":1997},"cmv7rhq9501axhikyd2tinz05",{"name":195,"id":1999},"b9a5c59c-f5aa-9271-5c8e-f1b73454611a",{"name":200,"id":2001},"59a4fa36-7339-4806-a829-29ec0271f10b",{"name":206,"id":2003},"3d0e1f4c-8d3b-4d05-a140-49afa0188d08",{"name":211,"id":2005},"757c7a8b-dc26-4dcc-9b8f-ee08e67e670f",{"list":2007,"total":2046,"page":541,"pageSize":1232,"totalPages":556},[2008,2013,2019,2024,2030,2037],{"id":2009,"name":2010,"category":6,"groupCategory":7,"intro":2011,"scale":162,"maturity":10,"checkState":705,"nodeCount":1232,"companyCount":2012},"ch60_E11","LED与第三代半导体产业链","碳化硅、氮化镓、LED照明、功率器件",92,{"id":2014,"name":2015,"category":6,"groupCategory":7,"intro":2016,"scale":2017,"maturity":10,"checkState":705,"nodeCount":38,"companyCount":2018},"e0c81c4e-878c-4944-9633-2c202497ef16","云计算与大数据产业链","云服务、数据中心、数据处理、数据交易","中国云计算市场规模约8288亿元（信通院，2024年，同比+34.4%），其中公有云6216亿元；智能算力规模超1590 EFLOPS（工信部，2026-01）",163,{"id":2020,"name":2021,"category":6,"groupCategory":7,"intro":2022,"scale":2023,"maturity":10,"checkState":705,"nodeCount":1232,"companyCount":2012},"00ee3af3-fe37-4d60-81ef-2833c238866c","人工智能产业链","AI芯片、大模型、算法框架、AI应用","中国人工智能核心产业规模超1.2万亿元(工信部，2025)",{"id":2025,"name":2026,"category":6,"groupCategory":7,"intro":2027,"scale":162,"maturity":2028,"checkState":705,"nodeCount":40,"companyCount":2029},"ch60_S02","人才与教育供给链","高等教育、职业教育、人才引进、技能培训","成熟期",28,{"id":2031,"name":2032,"category":6,"groupCategory":7,"intro":2033,"scale":2034,"maturity":2035,"checkState":705,"nodeCount":1232,"companyCount":2036},"d5c035fb-13ce-442e-b94e-6ac79b0b5b85","区块链与Web3产业链","区块链底层、联盟链、数字资产、分布式应用","中国区块链市场规模IDC口径2025年超32亿美元；国内区块链信息服务备案编号累计发放20批次4223个（国家网信办《国家信息化发展报告2025》）","孕育期",44,{"id":2038,"name":2039,"category":6,"groupCategory":2040,"intro":2041,"scale":2042,"maturity":2043,"checkState":705,"nodeCount":2044,"companyCount":2045},"90644f83-8a70-4b3a-ad53-8a2b0e397d5a","卫星互联网","FUTURE","卫星互联网指以低轨星座为基础，提供宽带通信、导航增强、物联网接入等天地一体化信息服务的产业。本链聚焦卫星组网运营、地面设备与终端及行业应用；火箭与卫星制造发射的运载环节归入'商业航天'链。核心工程包括GW星座(中国星网约1.3万颗)与千帆\u002FG60星座(垣信约1.5万颗)。到2030年产业链规模有望突破1.2万亿元(券商口径)。","中国低轨卫星互联网到2030年带动产业链规模有望突破1.2万亿元(券商\u002F机构口径，2026)；2024年起两大星座进入高密度组网","TRL6-8(组网\u002F试运行)；消费终端TRL5-7",15,40,30]